Production Capabilities:
    Min. Trace: 3 mil
    Min. Space: 3 mil
    Min. Hole Via: 6 mil
    Hole Via Tol.: +/-2 mil
    Board Thickness:20 mil~93 mil
    Board Thickness Tol.: Double Sides: +/-5%, Multilayer: +/-5%
    Max. Board Shape:18" x 24" (457mm x 609mm)
    Shape Size Tol.: NC Routing: +/-4 mil,  Mold Forming: +/-8 mil
    Min. SMT Test Pitch: 4 mil
    Inspection Spec.:IPC-A600-E HANSONIC SOP-001 Spec.
    Return Ratio: 0.05%
Type of Boards:
    Hot Air Solder Leveling Board
    Nickel Plated Board
    Immersion Gold
    Immersion Tin
    Immersion Silver
    Gold Finger Plated
    Routed Piece Board
    V-Cut Panel Board
    Punching Piece Board
    Break Apart Board
    Push Back Panel Board
MD&M Minneapolis 2013
We are at:
Minneapolis - Oct. 29 to 30, 2013
ISO/TS 16949
ISO 14001
Our focus and services are part of a wide spectrum of businesses that involves the following areas of expertise:
   Cell phone and Accessories
   Phone Set, Exchanger,
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